ACMReserchInc


Founded in 1998 in Silicon Valley, ACM Research, Inc. provides wet processing technology, systems, and key manufacturing products targeted to a range of semiconductor IC manufacturing and wafer-level

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packaging applications. The company specializes in developing cleaning technologies for advanced semiconductor device manufacturing. Known for its expertise in ultra-low-K dielectric and copper integration, the company initially focused on stress-free copper polishing technology. Its first product was introduced in 2001 and sold to leading-edge wafer manufacturers in the U.S. In 2003, to address increasing challenges in defect reduction that plagued emerging generations of IC chips, ACM Resea

California, United States of America
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ACMReserchInc
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US 8792-8713-7674-5919
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ACM Research Inc.
Founded in 1998 in Silicon Valley, ACM Research, Inc. provides wet processing technology, systems, and key manufacturing products targeted to a range of semiconductor IC manufacturing and wafer-level packaging applications.
Founded in 1998 in Silicon Valley, ACM Research, Inc. provides wet processing technology, systems, and key manufacturing products targeted to a range of semiconductor IC manufacturing and wafer-level packaging applications. The company specializes in developing cleaning technologies for advanced semiconductor device manufacturing. Known for its expertise in ultra-low-K dielectric and copper integration, the company initially focused on stress-free copper polishing technology. Its first product was introduced in 2001 and sold to leading-edge wafer manufacturers in the U.S. In 2003, to address increasing challenges in defect reduction that plagued emerging generations of IC chips, ACM Research developed its innovative single-wafer cleaning equipment, which features the company’s proprietary Space Alternated Phase Shift (SAPS™) and Timely Energized Bubble Oscillation (TEBO™) megasonic cleaning technologies. In particular, ACM’s revolutionary TEBO technology is enabling future generations of semiconductor capability. These capabilities are delivered on high-throughput chamber and platform designs.
 
US 8792-8713-7674-5919
ACMReserchInc
Participant 11/2023 valid 11/2024
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